Principal Packaging Engineer

with expertice in advanced laminate packaging technologies to support new product development (NPI) of RF System in Package (SiP... Chip Bumping, Fan Out, WLCSP, BGA, Module Level Shielding, and IPDs. Experience in Advanced RF SiP Moldules: Dual Side BGA...

Lugar: San Jose, CA | 26/02/2026 18:02:02 PM | Salario: S/. $129400 - 247800 per year | Empresa: Skyworks

Package Design Engineer

feasibility for multi-chip SiP packaging. Lead all aspects of package layout based on I/O, SI-PI and form factor requirements...

Lugar: Santa Clara, CA | 27/03/2026 21:03:39 PM | Salario: S/. $158600 - 234650 per year | Empresa: Marvell

Senior Software Engineer (Java)

workflows Handle real-time market data using proprietary and SIP feeds Support post-trade processing, reconciliation...-on experience with electronic trading systems and FIX Protocol Strong knowledge of market data feeds, both proprietary and SIP...

Lugar: Nueva York, NY | 27/01/2026 19:01:44 PM | Salario: S/. $225000 per year | Empresa: RightClick Recruiting

Senior Voice Engineer

modeling Strong understanding of SIP, RTP, call flows, jitter, carrier integrations, and network protocols Proven...

Lugar: San Francisco, CA | 10/03/2026 19:03:50 PM | Salario: S/. $148500 - 223900 per year | Empresa: Salesforce

Mgr Applications

, Amazon Connect, Five9, Cisco UCCE/UCCX, Avaya). Experience with telephony infrastructure, SIP, VoIP, call routing...

Lugar: Northbrook, IL | 03/02/2026 01:02:28 AM | Salario: S/. $134000 - 201000 per year | Empresa: Medline Industries