Hardware & Silicon Validation Principal Engineer

group designs and develops test platforms for validating multi-core Arm-based Network processors and custom ASIC’s, used..., auto-neg with different switches, SFP modules, DAC etc. Design and implement Python-based automation frameworks...

Lugar: Santa Clara, CA | 24/02/2026 19:02:22 PM | Salario: S/. $150680 - 225700 per year | Empresa: Marvell

Mechanical Engineering Intern

Unit or Corporate Group: This position will be part of the ​DIGITAL DATA NETWORKS BUSINESS UNIT--delivers high... engineers on multi-disciplinary projects Assisting in design, test, and validation of Direct Attach Copper (DAC), Active Copper...

Lugar: Middletown, PA | 02/02/2026 02:02:05 AM | Salario: S/. $20.01 - 42.48 per hour | Empresa: TE Connectivity

Staff Analog Mixed-Signal Design - Optical

, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead. Your Team, Your Impact Marvell's Broadband Analog group...). This group is the market leader in delivering TIAs and Drivers for Data Center and Telecom markets. We address the bandwidth...

Lugar: Westlake Village, CA | 01/02/2026 02:02:59 AM | Salario: S/. $120200 - 177930 per year | Empresa: Marvell

Principal Analog Mixed-Signal Design - Optical

, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead. Your Team, Your Impact Marvell's Broadband Analog group... Interferometer Modulators (MZMs). This group is the market leader in delivering TIAs and Drivers for Data Center and Telecom markets...

Lugar: Westlake Village, CA | 31/01/2026 18:01:23 PM | Salario: S/. No Especificado | Empresa: Marvell

RF/Mixed Signal Design Engineering Intern

implementation ADC/DAC Design: Apply knowledge of converter architectures and principles in developing data converter blocks... group. EEO is the Law: . Job Req Type: Internship/Cooperative Required Travel: Yes, 10% of the time The expected wage...

Lugar: Wilmington, MA | 03/01/2026 19:01:17 PM | Salario: S/. No Especificado | Empresa: Analog Devices

Principal Advanced Packaging Design Engineer

for the next generation high performance computing (HPC), Artificial Intelligence (AI) and networking solutions. The group... generation HBM, DDR, SerDes, D2D, D2H, ADC, DAC, PCIE, Ethernet, etc Good understanding of signal and power integrity...

Lugar: Burlington, VT | 16/12/2025 22:12:40 PM | Salario: S/. No Especificado | Empresa: Marvell
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