and philanthropic initiatives Sager Electronics, a TTI, Inc. Company, is a North American distributor of Interconnect, Power... Engineer I to support manufacturing and product quality through inspection planning, quality system execution, and continuous...
Job Title: Field Application Engineer Company: One Stop Systems, Inc. (NASDAQ: OSS) Headquarters Location... and contribute to cutting-edge projects in a dynamic and supportive environment. Company Overview: One Stop Systems, Inc. (Nasdaq...
in semiconductor process integration, metallization, and interconnect technologies. You will work alongside experienced integration... engineers to develop, optimize, and transfer advanced DRAM BEOL process flows. Strong fundamentals in materials science...
Lugar:
Boise, ID | 16/04/2026 02:04:34 AM | Salario: S/. No Especificado | Empresa:
Micron in semiconductor process integration, contact formation, local interconnect, and the critical interface between Middle-Of-Line (MOL...) and Capacitor (Cap) layers. You will work alongside experienced integration engineers to develop, optimize, and transfer advanced...
Lugar:
Boise, ID | 15/04/2026 19:04:23 PM | Salario: S/. No Especificado | Empresa:
Micron across advanced aerospace and defense programs. This role requires a seasoned professional with experience supporting high.... This position supports suppliers contributing to space systems, defense electronics, mission systems, and advanced aerospace...
TTM Technologies, Inc. – Publicly Traded US Company, NASDAQ (TTMI) – Top-5 Global Printed Circuit Board Manufacturer... About TTM TTM Technologies, Inc. is a leading global manufacturer of technology products, including mission systems, radio...
) Certified Interconnect Designer (CID) – Basic or Advanced through IPC. Contact: Vinay Kumar: [email protected] Direct... for Manufacturing (DFM) and reviewed by senior team members. Develop knowledge and understanding of the organization's policies...
, qualification, and successful transfer to high‑volume manufacturing. Deep, practical expertise in advanced packaging... closely with our global R&D and manufacturing teams, we ensure the efficient transfer and implementation of new technology...
Lugar:
Boise, ID | 11/04/2026 21:04:04 PM | Salario: S/. No Especificado | Empresa:
Micron but are not limited to developing and enabling deployment of advancedinterconnect technologies. Successful development and deployment..., qualification, and successful transfer to high‑volume manufacturing. Deep, practical expertise in advanced packaging...
Lugar:
Boise, ID | 11/04/2026 19:04:24 PM | Salario: S/. No Especificado | Empresa:
Micron, and manufacturing teams. Responsibilities Develop multi-level Au/Cu interconnect processes including deposition, patterning, etch... Au and Cu metallization interconnect development, plasma etch and developing process building blocks to support 3D stacking while partnering...