Plating Equipment Engineer

As a Finish Team (Bond, CMP, Plating) Equipment Engineer with Broadcom Limited’s Wireless Semiconductor Division (WSD...

Lugar: Fort Collins, CO | 28/01/2026 21:01:17 PM | Salario: S/. $91000 - 146000 per year | Empresa: Broadcom

Lead Engineer, Materials Quality Engineering- Business Operations

with a strong commitment to excellence and the drive to help build a worldclass raw material supply chain for the industry’s most advanced CMP... quality for nextgeneration N2 and beyond CMP applications. In this role, the engineer will use statistical and analytical...

Lugar: Hillsboro, OR | 12/02/2026 03:02:42 AM | Salario: S/. $114000 - 142500 per year | Empresa: Entegris

Lead Engineer, Materials Quality Program Management

CMP Polishing Pads. This role sits within the Materials Solutions Division and plays a pivotal part in advancing raw... material quality for nextgeneration N2 and beyond CMP applications. The ideal candidate brings a strong technical foundation...

Lugar: Hillsboro, OR | 12/02/2026 00:02:15 AM | Salario: S/. $114000 - 142500 per year | Empresa: Entegris