Package Design Engineer

towards standardization and group success. Work with marketing, probe, assembly, test, process integration, and product engineering groups... with modeling and simulation using industry-standard simulators. Contribute to cross-group communication to work...

Lugar: Boise, ID | 10/04/2026 17:04:34 PM | Salario: S/. No Especificado | Empresa: Micron

HBM SoC Design Engineer

Engineer, you will be part of the Heterogeneous Integration Group (HIG), contributing to the design, development..., and product teams to implement robust, high‑performance SoC solutions that meet ambitious power, performance, area, and schedule...

Lugar: Richardson, TX | 26/03/2026 03:03:00 AM | Salario: S/. No Especificado | Empresa: Micron

HBM SoC Physical Design Engineer

Physical Design Engineer in the Heterogeneous Integration Group (HIG), you will drive the implementation of advanced HBM SoC..., packaging/assembly, and manufacturing teams to deliver best‑in‑class PPA (performance, power, area) and robust signoff...

Lugar: Richardson, TX | 25/03/2026 22:03:07 PM | Salario: S/. No Especificado | Empresa: Micron