Senior Technologist, Hybrid Bonding Module

Job Details: Job Description: The Role and Impact As a Senior Technologist for Die-to-Wafer Hybrid Bonding (HBI), you will drive process and equipment development for next-generation hybrid bonding technologies, enabling Intel's leade...

Lugar: Hillsboro, OR | 08/06/2026 01:06:39 AM | Salario: S/. No Especificado | Empresa: Intel

NMSi- F11x Dry Etch Module Group Leader

Job Details: Job Description: NMSi has a unique charter to not only deliver high-volume manufacturing products but additionally design and develop Silicon Photonics (SiP), EMIB, and Foveros. NMSI is seeking a Module Group Leader (MGL) f...

Lugar: Albuquerque, NM | 06/06/2026 00:06:27 AM | Salario: S/. $140830 - 198820 per year | Empresa: Intel

Packaging Module Development Engineer

Job Details: Job Description: The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile, edge, and...

Lugar: Phoenix, AZ | 04/06/2026 23:06:54 PM | Salario: S/. No Especificado | Empresa: Intel

Certified Dorothy - Home Health Epic module - Build Analyst

Role: Certified Dorothy (Home Health Epic module) Build Analyst Duration: 3+ months at 10 hrs a week Required skillset: Dorothy certified Epic build analyst to implement PHC Home Health optimization and enhancement tickets. Dorothy ce...

Lugar: Dallas, TX | 04/06/2026 00:06:34 AM | Salario: S/. No Especificado | Empresa: Vytwo

Principal Engineer, Hybrid Bonding Module

Job Details: Job Description: As a Principal Engineer for Die-to-Wafer Hybrid Bonding (HBI) module, you will play a pivotal role in defining and scaling next-generation advanced packaging technologies that enable Intel's leadership in h...

Lugar: Hillsboro, OR | 03/06/2026 01:06:47 AM | Salario: S/. No Especificado | Empresa: Intel

Module Development Engineer

Job Details: Job Description: As a Module Development Engineer, you will be at the forefront of Intel's semiconductor manufacturing innovation, driving the design and development of advanced manufacturing processes and enabling technolo...

Lugar: Hillsboro, OR | 02/06/2026 23:06:02 PM | Salario: S/. $133800 - 188890 per year | Empresa: Intel