Senior Integrated Photonics Packaging Engineer (RF)

that unite PICs, light sources, photodetectors, and analog circuitry. By managing global suppliers and innovating beyond existing... for Manufacturability (DFM) and PCB/package layouting using advanced packaging materials and substrate technologies (HTCC, LTCC, HDI, Build...

Lugar: Stuttgart, Baden-Württemberg | 25/07/2026 17:07:39 PM | Salario: S/. No Especificado | Empresa: Q.ANT