Senior Photonics Packaging Engineer

AI and HPC applications. As Senior Photonics Packaging Engineer (f/m/d), you will lead the specification, development... Qualifications: Experience with photonic integrated circuit (PIC) packaging for AI or HPC applications Knowledge of high-speed...

Lugar: Stuttgart, Baden-Württemberg | 06/12/2025 18:12:25 PM | Salario: S/. No Especificado | Empresa: Q.ANT GmbH