求人内容 車載MCU（マイクãƒã‚³ãƒ³ãƒˆãƒãƒ¼ãƒ©ï¼‰å¸‚å ´ã¯è‡ªå‹•è»Šã®é›»å‹•åŒ–（EV）や自動é‹è»¢æŠ€è¡“（ADAS）ã®é€²åŒ–ã‚’å—ã‘大幅ãªæ‹¡å¤§ãŒè¦‹è¾¼ã¾ã‚Œã¦ã„ã¾ã™ã€‚ ルãƒã‚µã‚¹ã®ä¸æ ¸ã§ã‚る本事æ¥ã‚’æ›´ã«å¼·åŒ–ã—ã¦ã„ãå¿…è¦ãŒã‚ã‚Šã€ãã®ãŸã‚ã®ä½“制強化ãŒæ€¥å‹™ã€å³æˆ¦åŠ›ã¨ãªã‚‹äººæを募集ã—ã¦ã„ã¾ã™ã€‚ 本ãƒã‚¸ã‚·ãƒ§ãƒ³ã§ã¯ã€è»Šè¼‰MCU製å“ã®ãƒ“ジãƒã‚¹ãŠã‚ˆã³ãƒ—ãƒãƒ•ã‚£ãƒƒãƒˆãƒžãƒã‚¸ãƒ¡ãƒ³ãƒˆã‚’æ‹…ã„ã€äº‹æ¥ã®æˆé•·ã¨åŽç›Šæœ€å¤§åŒ–ã«è²¢çŒ®ã„ãŸã ãã¾ã™ã€‚ 車載MCU製å“ã®ãƒ“ジãƒã‚¹ãŠã‚ˆã³åˆ©ç›Šç®¡ç† 商談管ç†ãŠã‚ˆã³ãƒ‡ãƒ¼ã‚¿åˆ†æž å–¶æ¥ã¨é€£æºã—ãŸ...
with respect to RH850 or ARM devices and their ecosystems. Drive the market introduction of Renesas MCU's products in cooperation... with Marketing, Sales, FAEs, and device design teams to ensure technical requirements are met when new Renesas products are being...
Job Description ã€èƒŒæ™¯ã€‘ 当社ã¯ã€ã‚°ãƒãƒ¼ãƒãƒ«ã«çµ±åˆã•ã‚ŒãŸèªè¨¼ãƒ»ID管ç†åŸºç›¤ã®ã€Œå†…製化ã€ã‚’強化ã—ã¦ãŠã‚Šã€Microsoft Entra ID（Azure AD）ã€SSO (SAML/OIDC)ã€Active Directory ã‚’ä¸å¿ƒã¨ã—ãŸã‚¢ã‚¤ãƒ‡ãƒ³ãƒ†ã‚£ãƒ†ã‚£é ˜åŸŸã«ãŠã‘る専門性を拡充ã™ã‚‹ãŸã‚ã€2åã®ã‚¨ãƒ³ã‚¸ãƒ‹ã‚¢ã‚’募集ã—ã¾ã™ã€‚ 候補者ã®å¼·ã¿ã‚„çµŒé¨“é ˜åŸŸã«å¿œã˜ã¦ã€æ‹…当範囲ã¯æŸ”軟ã«èª¿æ•´ãŒå¯èƒ½ã§ã™ã€‚ ã€æ¥å‹™å†…容】 以下ã®æ¥å‹™ã®ã†ã¡ã€ã‚ãªãŸã®å¼·ã¿ãƒ»çµŒé¨“ã«å¿œã˜ãŸé ˜...
Job Description ã€Reason for Hiring】 We are looking for an experienced SoC Architecture Engineer for high performance SOCs & MCUs, to support the Technical Project Leaders/Chip leads and SOC Architecture organization working closely with ...
Job Description ã€Reason for Hiring】 We are looking for an experienced leader for high performance SOCs & MCUs, to lead the Technical Project Leaders/Chip leads and SOC Architecture organization working closely with business, product mark...
Job Description ã€å‹Ÿé›†èƒŒæ™¯ã€‘ 当社ã§ã¯ã€æ¬¡ä¸–代パッケージ技術（Flip Chipã€SiP ãªã©ï¼‰ã®é–‹ç™ºã‚’ä¸å¿ƒã«ã€åŠå°Žä½“後工程ã«ãŠã‘る技術é©æ–°ã‚’ç©æ¥µçš„ã«æŽ¨é€²ã—ã¦ã„ã¾ã™ã€‚ 特㫠AI・高性能コンピューティング（HPC）ã€è»Šè¼‰ã€IoT 分野ã«ãŠã„ã¦ã¯ã€ã‚ˆã‚Šé«˜å¯†åº¦ãƒ»é«˜ä¿¡é ¼æ€§ãƒ»é«˜æ”¾ç†±æ€§ã‚’å‚™ãˆãŸãƒ‘ッケージ技術ãŒæ±‚ã‚られã¦ãŠã‚Šã€FCCSP（Flip Chip Chip Scale Package）や FCBGA ã¨ã„ã£ãŸå…ˆç«¯æŠ€è¡“ã®é–‹ç™ºãŒåŠ 速ã—ã¦ã„ã¾ã™ã€‚ 今後ã€ãƒ‡...
Job Description ã€å‹Ÿé›†èƒŒæ™¯ã€‘ 当社ã§ã¯ã€æ¬¡ä¸–代パッケージ技術（Flip Chipã€SiP ãªã©ï¼‰ã®é–‹ç™ºã‚’ä¸å¿ƒã«ã€åŠå°Žä½“後工程ã«ãŠã‘る技術é©æ–°ã‚’ç©æ¥µçš„ã«æŽ¨é€²ã—ã¦ã„ã¾ã™ã€‚ 特㫠AI・高性能コンピューティング（HPC）ã€è»Šè¼‰ã€IoT 分野ã«ãŠã„ã¦ã¯ã€ã‚ˆã‚Šé«˜å¯†åº¦ãƒ»é«˜ä¿¡é ¼æ€§ãƒ»é«˜æ”¾ç†±æ€§ã‚’å‚™ãˆãŸãƒ‘ッケージ技術ãŒæ±‚ã‚られã¦ãŠã‚Šã€FCCSP（Flip Chip Chip Scale Package）や FCBGA ã¨ã„ã£ãŸå…ˆç«¯æŠ€è¡“ã®é–‹ç™ºãŒåŠ 速ã—ã¦ã„ã¾ã™ã€‚ 今後ã€ãƒ‡...
Job Description ã€å‹Ÿé›†èƒŒæ™¯ã€‘ ç±³æ²¢å·¥å ´ã§ã¯ã€è»Šè¼‰å‘ã‘ã«æŽ¡ç”¨ã•ã‚Œã‚‹é«˜å“質ãªåŠå°Žä½“パッケージを生産ã—ã¦ãŠã‚Šã¾ã™ã€‚ 今後も新製å“ã®ç«‹ã¡ä¸Šã’ãŒäºˆå®šã•ã‚Œã¦ãŠã‚Šã€æ–°æ料や新装置ã®å°Žå…¥ã‚’å«ã‚ã€æŠ€è¡“é©æ–°ã‚’ç©æ¥µçš„ã«æŽ¨é€²ã—ã¦ã„ã¾ã™ã€‚ è¿‘å¹´ã€é–‹ç™ºã‚¹ãƒ”ードãŒã¾ã™ã¾ã™åŠ 速ã™ã‚‹ä¸ã§ã€å††æ»‘ã«æ–°è£½å“開発をå–ã‚Šã¾ã¨ã‚ã€ãƒ—ãƒã‚¸ã‚§ã‚¯ãƒˆã‚’リードã§ãる人æã®å¼·åŒ–ãŒä¸å¯æ¬ ã¨ãªã£ã¦ã„ã¾ã™ã€‚ ãã®ãŸã‚当社ã§ã¯ã€åŠå°Žä½“パッケージ開発ã«ãŠã‘る経験や知è˜ã‚’æ´»ã‹ã—ã€é–‹ç™ºæ¡ˆä»¶ã‚’牽引ã„ãŸã ã‘る方を募集ã„ãŸ...
Job Description ã€å‹Ÿé›†èƒŒæ™¯ã€‘ 当社ã§ã¯ã€æ¬¡ä¸–代パッケージ技術（Flip Chipã€SiP ãªã©ï¼‰ã®é–‹ç™ºã‚’ä¸å¿ƒã«ã€åŠå°Žä½“後工程ã«ãŠã‘る技術é©æ–°ã‚’ç©æ¥µçš„ã«æŽ¨é€²ã—ã¦ã„ã¾ã™ã€‚ 特㫠AI・高性能コンピューティング（HPC）ã€è»Šè¼‰ã€IoT 分野ã«ãŠã„ã¦ã¯ã€ã‚ˆã‚Šé«˜å¯†åº¦ãƒ»é«˜ä¿¡é ¼æ€§ãƒ»é«˜æ”¾ç†±æ€§ã‚’å‚™ãˆãŸãƒ‘ッケージ技術ãŒæ±‚ã‚られã¦ãŠã‚Šã€FCCSP（Flip Chip Chip Scale Package）や FCBGA ã¨ã„ã£ãŸå…ˆç«¯æŠ€è¡“ã®é–‹ç™ºãŒåŠ 速ã—ã¦ã„ã¾ã™ã€‚ 今後ã€ãƒ‡...
Job Description ã€å‹Ÿé›†èƒŒæ™¯ã€‘ 当社ã§ã¯ã€æ¬¡ä¸–代パッケージ技術（Flip Chipã€SiP ãªã©ï¼‰ã®é–‹ç™ºã‚’ä¸å¿ƒã«ã€åŠå°Žä½“後工程ã«ãŠã‘る技術é©æ–°ã‚’ç©æ¥µçš„ã«æŽ¨é€²ã—ã¦ã„ã¾ã™ã€‚ 特㫠AI・高性能コンピューティング（HPC）ã€è»Šè¼‰ã€IoT 分野ã«ãŠã„ã¦ã¯ã€ã‚ˆã‚Šé«˜å¯†åº¦ãƒ»é«˜ä¿¡é ¼æ€§ãƒ»é«˜æ”¾ç†±æ€§ã‚’å‚™ãˆãŸãƒ‘ッケージ技術ãŒæ±‚ã‚られã¦ãŠã‚Šã€FCCSP（Flip Chip Chip Scale Package）や FCBGA ãªã©ã®é–‹ç™ºãŒåŠ 速ã—ã¦ã„ã¾ã™ã€‚ 今後ã€ãƒ‡ãƒã‚¤ã‚¹ã®è¤‡é›‘...