Advance Packaging Technology Development Engineer

. Actual experience with TCB (Thermal Compression Bonding), CMP (Chemical Mechanical Polish), and Ball Mount is a plus. Finally, hands... molding, wafer level ball mount, TCB, FC, UF, Hybrid bond, Glass carrier bond/ de-bond.Problem-Solving Abilities...

Lugar: Jalisco | 26/12/2024 18:12:15 PM | Salario: S/. No Especificado | Empresa: Micron Technology, Inc

Supervisor Warehouse I

.**Avance en su carrera en Ball, líder mundial en la fabricación de envases de aluminio sostenibles. ¡Logre cosas...!**¡Ball está encantada de recibir el premio de Newsweek de Top 100 Global Most Loved Workplace 2023! Como líder en productos...

Lugar: Nayarit | 26/12/2024 18:12:24 PM | Salario: S/. No Especificado | Empresa: Ball Corporation

Advance Packaging Technology Development Engineer

is required. Actual experience with TCB (Thermal Compression Bonding), CMP (Chemical Mechanical Polish), and Ball Mount is a plus. Finally, hands... molding, wafer level ball mount, TCB, FC, UF, Hybrid bond, Glass carrier bond/de-bond.Problem-Solving Abilities...

Lugar: Jalisco | 26/12/2024 18:12:37 PM | Salario: S/. No Especificado | Empresa: Micron Technology, Inc

Montacarguista

.**Avance en su carrera en Ball, líder mundial en la fabricación de envases de aluminio sostenibles. ¡Logre cosas... CUALQUIER ANOMALIDAD AL SUPERVISOR.- MANEJAR A UNA VELOCIDAD MODERADA.- NO GOLPEAR TARIMAS.**Ball Corporation es un empleador que ofrece...

Lugar: Nuevo Leon | 26/12/2024 18:12:47 PM | Salario: S/. No Especificado | Empresa: Ball Corporation

Key Account Manager Liverpool

;step up when you see a need..OWNERSHIP: Pick up the ball. Be proactive, take responsibility and follow-through.INNOVATION...

Lugar: Veracruz, Ver. | 26/12/2024 18:12:15 PM | Salario: S/. No Especificado | Empresa: Adidas

Supervisor Plant Warehouse

**Avance en su carrera en Ball, líder mundial en la fabricación de envases de aluminio sostenibles. ¡Logre cosas...**- Essential: Spanish- Desirable: English**Other Requirements**- Resolve conflicts.- Adaptable to change.**Ball Corporation...

Lugar: Nuevo Leon | 26/12/2024 18:12:40 PM | Salario: S/. No Especificado | Empresa: Ball Corporation

Advance Packaging Technology Development Engineer

is required. Actual experience with TCB (Thermal Compression Bonding), CMP (Chemical Mechanical Polish), and Ball Mount is a plus. Finally, hands... molding, wafer level ball mount, TCB, FC, UF, Hybrid bond, Glass carrier bond/de-bond.Problem-Solving Abilities...

Lugar: Jalisco | 26/12/2024 18:12:11 PM | Salario: S/. No Especificado | Empresa: Micron Technology, Inc

Advance Packaging Technology Development Engineer

. Actual experience with TCB (Thermal Compression Bonding), CMP (Chemical Mechanical Polish), and Ball Mount is a plus. Finally, hands..., CVD, CMP, wafer level molding, wafer level ball mount, TCB, FC, UF, Hybrid bond, Glass carrier bond/ de-bond.Problem...

Lugar: Jalisco | 26/12/2024 18:12:26 PM | Salario: S/. No Especificado | Empresa: Micron Technology, Inc
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