Package Design Engineer

***: **KNOWLEDGE & EXPERIENCE**: - 10 or more years of relevant industry experience and knowledge in semiconductor package design with a specific focus on leading edge substrate-based packages such as Wire-Bond and Flip Chip PBGA. - Expe...

Lugar: Jalisco | 05/01/2026 18:01:30 PM | Salario: S/. No Especificado | Empresa: Nacuri S De Rl De Cv
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