PhD position in multi-material additive manufacturing for advanced chip cooling
metals such as copper. The rapid growth of AI and high-performance computing is driving heat fluxes in advanced chip..., and thermal transport across copper-silicon interfaces. You will work with characterization methods including SEM, EBSD, XRD...
Lugar: Enschede, Overijssel | 10/06/2026 22:06:42 PM | Salario: S/. €3059 mensual | Empresa: Universiteit Twente