Packaging Engineer
that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded... analysis, and issue resolution with guidance Supports substrate design reviews, understands stack-ups, line/space requirements...
Lugar: Hsinchu City | 21/01/2026 20:01:28 PM | Salario: S/. No Especificado | Empresa: Advanced Micro Devices