IC top level floorplanning and understanding of hard macro block placement, padring, RDL and bump pattern/assignment. System level co-design methodology of IC, Package and PCB/Board. Concept analysis for new product package selection based ...
Serve as Quality Engineering representative in NPI core teams, ensure reliability, supplier readiness, customer RMA readiness, and product readiness deliverables are met for new product launch. Work with cross-functional teams (QRE, Packagi...
職缺描述 我們是英業達車用電子團隊，正在尋找以下人才: 1.有IVI(In-Vehicle infotainment)開發經驗的人。 2.曾參與過Qualcomm SoC BSP porting的人(QNX hypervisor...
或AIoT (Smart Home/Smart Building)產業經驗，含3 年以上帶領團隊或技術主導經驗 2. 熟悉 ARM SoC 平台(Ambarella / Sigmastar / Qualcomm / NXP等 ) 3...
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Taiwán | 11/02/2026 02:02:09 AM | Salario: S/. 40000 mensual