Summer Intern- CPU Power Analysis Engineer

Your responsibilities lie primarily in the physical interaction with devices to enable measurement and data collection. Graduate students major in Computer Science, Computer Engineering, Electrical Engineering, Power Engineering, or closely...

Lugar: Hsinchu City | 04/03/2026 19:03:54 PM | Salario: S/. No Especificado | Empresa: Qualcomm

Summer Intern- Machine Learning FSDO System Analyst

Workflow Design: Establish a structured workflow where the AI agent orchestrates tasks through predefined code paths, ensuring predictability, consistency and reusable for well-defined tasks. Currently pursuing a bachelor's in Computer Scie...

Lugar: Hsinchu City | 04/03/2026 19:03:50 PM | Salario: S/. No Especificado | Empresa: Qualcomm

Summer Intern- WiFi Hardware Engineer

Customer Issue Resolution: Handle customer inquiries related to product features, hardware issues, and integration challenges. Design Review & Support: Conduct hardware design reviews, especially for RF and power designs;assist customers w...

Lugar: Taipei City | 04/03/2026 18:03:59 PM | Salario: S/. No Especificado | Empresa: Qualcomm

Summer Intern- WiFi Software Engineer

Develop Automation Tools: Create and enhance tools for automating WiFi performance and stability testing processes. Troubleshoot WiFi Issues: Investigate and address problems related to WiFi performance and stability, employing advanced tro...

Lugar: Taipei City | 04/03/2026 18:03:59 PM | Salario: S/. No Especificado | Empresa: Qualcomm

AI Development Engineer, up to Staff

Enable Engineering Excellence: Support initiatives that improve product engineering through VLSI Product KPI/yield analysis, as well as failure root cause analysis, significantly increase engineer team's efficiency & productivity. Perform E...

Lugar: Hsinchu City | 04/03/2026 00:03:42 AM | Salario: S/. No Especificado | Empresa: Qualcomm

Reliability Engineer - Staff

- 7+ years of experience in semiconductor product reliability tests, including ELFR, HTOL, ESD, Latch-up, package level preconditioning, unbiased HAST or Autoclave, biased HAST or THB, Temperature Cycling, Power Temperature Cycling, HTS, et...

Lugar: Hsinchu City | 04/03/2026 00:03:21 AM | Salario: S/. No Especificado | Empresa: Qualcomm

Staff Advanced Packaging Engineer

Management and integration lead experience will be a plus. Responsible for exploring, development and HVM deployment of bumping, WLP, FOWLP, FOPLP, 2.5D RDL packaging technologies. Responsible for initiating & defining package process flow,...

Lugar: Hsinchu City | 02/03/2026 03:03:11 AM | Salario: S/. No Especificado | Empresa: Qualcomm