and develop package and interconnect methods for Renesas’s packaging needs in the areas of Power SiP/modules, wafer level, flip... and maintain technical expertise on advances and innovations in power SiP/modules, wafer level packaging & flip chip interconnects...
1.碩士以上，電子、電機，材料及機械相關畢 2.RF SIP module or other function module package design team lead more than 10 years. 3...
Department BP-TS Reporting to department manager Location 中壢市 Responsibilities SIP解決方案研發 1.失效模式分析 2.電氣特性分析 3.專案...協調 4.封裝創新, 新材料評估與實驗操作 Qualifications 1.熟悉SIP設計,材料特性以及製程有完整的認識與經驗 2.具備產品失敗分析能力 3.具備跨部門溝通技巧與問題解決能力 4.需具備獨立完成專案能力 三年...
of Power SiP/modules, wafer level, flip-chip, multi-chip module and power device packaging. Package technologies qualification... and innovations in power SiP/modules, wafer level packaging & flip chip interconnects. Participate in packaging roadmap development...
徵才說明 職缺更新：昨天 工作內容： 1.依據SOP / SIP，從事PCB手工錫焊作業 2.依據SOP / SIP，從事簡易錫爐錫焊作業 3.流動線生產 4.確保生產產品品質 5.從事主管交辦生產相關事項 * 薪資...
1.產品與模具設計，圖面建立與修改，熟悉3D(UG)和2D(AUTOCAD) 2.新產品開發與試產導入，檢驗測試標準與樣品打樣 3.ECN / BOM / SIP管理 4.專案與新產品開發規劃 5.與客戶討論、前端設計、分析、可行...
and SiP packaging solutions, including SSD/PSSD NAND BGA, uSD, SD/SD express and USB products. Support the development..., including Cadence SIP/Allegro, AutoCAD, CAM, and Valor for substrate and package design. Solid understanding of advanced...
-on experience with telecom signaling protocols (such as SS7, SIP, Diameter) in the design, development, and troubleshooting...
1:有投影機量測概念與實作。 2:須具備基本2D工程識圖能力。 3:具塑膠部品實務量測經驗者尤佳。 4:協助品保工程師處理文件.SIP或相關工作。 5:具品管量測檢驗經驗。...
, CoWoS, chiplets, fan-out wafer-level packaging (FOWLP), and system-in-package (SiP) with capacity by company, by technology...