Submissions Administrator

Job Summary As the GRAHAM business continues to grow, we are seeking to appoint a highly organised and proactive Submissions...-to-date pipeline and opportunity information. Manage incoming and outgoing post for the team, including packaging, labelling...

Lugar: Hillsborough, Co Down | 17/02/2026 18:02:24 PM | Salario: S/. No Especificado | Empresa: GRAHAM Group

Process Engineer

of semiconductor packaging processes, contributing to the delivery of high-impact industrial research, prototyping and scale-up... support for the establishment of the National Advanced Semiconductor Packaging and Integration Centre (NASPIC), based...

Lugar: Glasgow | 12/02/2026 01:02:03 AM | Salario: S/. £37694 - 46049 per year | Empresa: University of Strathclyde

Process Engineer

Semiconductor Packaging and Integration Centre (NASPIC), based within our new facility close to Glasgow Airport. The line... is unique in Europe and very rare elsewhere. NASPIC will explore and develop disruptive packaging and integration technologies...

Lugar: Glasgow Airport, Renfrewshire | 11/02/2026 18:02:56 PM | Salario: S/. £37694 - 46049 per year | Empresa: University of Strathclyde
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