Eng Sr - Quality

Recruiter Alison Dominick Job Description Our employees work on the world's most advanced electronics... About BAE Systems Electronic Systems BAE Systems, Inc. is the U.S. subsidiary of BAE Systems plc, an international defense...

Lugar: Los Angeles, CA | 25/06/2026 17:06:03 PM | Salario: S/. No Especificado | Empresa: BAE Systems

Staff PCB Designer

TTM Technologies, Inc. – Publicly Traded US Company, NASDAQ (TTMI) – Top-5 Global Printed Circuit Board Manufacturer... About TTM TTM Technologies, Inc. is a leading global manufacturer of technology products, including mission systems, radio...

Lugar: Farmingdale, NY | 18/06/2026 17:06:39 PM | Salario: S/. $101807 - 179040 per year | Empresa: TTM Technologies

Eng Sr - Optical

subsystems for space-based applications. In this role, you will execute advanced, precision assembly and microelectronic... packaging processes for focal planes that operate at the intersection of optical physics, advanced materials science, high-speed...

Lugar: Boulder, CO | 13/06/2026 17:06:00 PM | Salario: S/. No Especificado | Empresa: BAE Systems

Dsgn Spec Prin

or Fort Wayne, IN location. See what you're missing. Our employees work on the world's most advanced electronics... printed circuit board layouts with digital, analog, RF, power circuits and interconnect applications. Responsibilities...

Lugar: Fort Wayne, IN | 05/06/2026 21:06:08 PM | Salario: S/. No Especificado | Empresa: BAE Systems

Engineer, Semi Packaging Engineering

manufacturing ecosystems. Strong understanding of advanced semiconductor packages, modules, systems, heterogeneous integration...About Analog Devices Analog Devices, Inc. (NASDAQ: ) is a global semiconductor leader that bridges the physical...

Lugar: Wilmington, MA | 03/06/2026 01:06:53 AM | Salario: S/. $75200 - 103400 per year | Empresa: Analog Devices

Staff IC Packaging Engineer - Mechanical Simulation

## Company: Qualcomm Technologies, Inc. ## Job Area: Engineering Group, Engineering Group >Packaging... for current HVM and advanced packaging technologies. This role requires development of mechanical FEA models (preferably using...

Lugar: San Diego, CA | 13/05/2026 19:05:40 PM | Salario: S/. No Especificado | Empresa: Qualcomm

Eng Sr - Quality

's most advanced electronics - from detecting threats for F-35 pilots to illuminating the night for soldiers. Spanning air, land, sea... to ensure suppliers achieve robust manufacturing and acceptance plans to drive results. Expertise in specific manufacturing...

Lugar: Nashua, NH | 29/04/2026 23:04:08 PM | Salario: S/. $95000 - 105000 per year | Empresa: BAE Systems

Process Integration Engineer | APTD

manufacturing transfer. Deep, hands‑on expertise in advanced packaging and interconnect technologies, including 2.5D/3DIC... but are not limited to developing and enabling deployment of advancedinterconnect technologies. Successful development and deployment...

Lugar: Boise, ID | 29/04/2026 20:04:12 PM | Salario: S/. No Especificado | Empresa: Micron