PCB Design Electrical Engineer (Windsor, WI)

or TI TINA Experience with advanced circuit board layout such as HDI (micro vias, via in pad, blind and buried vias), controlled..., and understand electrical schematics and datasheets for digital and electrical devices A minimum of 6 months of experience...

Lugar: Wisconsin | 01/05/2026 02:05:10 AM | Salario: S/. $82000 - 100000 per year | Empresa: Genus

PCB Design Electrical Engineer (Windsor, WI)

or TI TINA Experience with advanced circuit board layout such as HDI (micro vias, via in pad, blind and buried vias), controlled..., and understand electrical schematics and datasheets for digital and electrical devices A minimum of 6 months of experience...

Lugar: Wisconsin | 29/04/2026 17:04:33 PM | Salario: S/. $82000 - 100000 per year | Empresa: Genus

Atom CPU Architecture Engineer

. With a legacy of relentless innovation and a commitment to bring smart, connected devices to every person on Earth, our diverse... functional modeling simulations, and conducts analysis of test results using advanced statistics and data predictions...

Lugar: Austin, TX | 23/04/2026 20:04:10 PM | Salario: S/. $122440 - 172860 per year | Empresa: Intel

CPU Performance Architect

. With a legacy of relentless innovation and a commitment to bring smart, connected devices to every person on Earth, our diverse... functional modeling simulations, and conducts analysis of test results using advanced statistics and data predictions...

Lugar: Austin, TX | 25/03/2026 19:03:39 PM | Salario: S/. No Especificado | Empresa: Intel

Lead CPU Design Engineer

. With a legacy of relentless innovation and a commitment to bring smart, connected devices to every person on Earth, our diverse... design of CPUs by employing advanced strategies and ensuring robust integration in system-on-chip (SoC) designs...

Lugar: Phoenix, AZ | 19/03/2026 21:03:00 PM | Salario: S/. No Especificado | Empresa: Intel

Substrate Supplier Enablement Engineer

Job Details: Job Description: The Advanced Packaging Technology Development (APTD) Substrate and Wafer Assembly... across advanced packaging suppliers. In this position, you will lead substrate supplier development and qualification activities...

Lugar: Phoenix, AZ | 07/03/2026 22:03:20 PM | Salario: S/. $140830 - 198820 per year | Empresa: Intel
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