Mechanical Principal Engineer, R&D

for (Preferred): Experience with Ansys and or Icepak FEA tools Excellent documentation and communication skills Excellent...

Lugar: Irvine, CA | 12/12/2025 00:12:34 AM | Salario: S/. No Especificado | Empresa: BD

Principal Design Engineer, TSV Packaging

for correlation of simulation activities. Develop semiconductor packages with advacned EDA techniques and simulation tools like ANSYS... and validation of electronic packages in Semiconductor industry or equivalent. Engineering tools: ANSYS Workbench, APDL, Abaqus, ProE...

Lugar: Boise, ID | 11/12/2025 21:12:06 PM | Salario: S/. No Especificado | Empresa: Micron