Principal Design Engineer, TSV Packaging

for correlation of simulation activities. Develop semiconductor packages with advacned EDA techniques and simulation tools like ANSYS... and validation of electronic packages in Semiconductor industry or equivalent. Engineering tools: ANSYS Workbench, APDL, Abaqus, ProE...

Lugar: Boise, ID | 11/12/2025 22:12:06 PM | Salario: S/. No Especificado | Empresa: Micron

Stress Engineer III (REMOTE)

of experience in the Aerospace Industry or in a related field. Advanced working knowledge of NASTRAN/ANSYS and MS Office products...

Lugar: USA | 11/12/2025 21:12:19 PM | Salario: S/. $116680 - 192360 per year | Empresa: Sonaca

Mechanical Principal Engineer, R&D

for (Preferred): Experience with Ansys and or Icepak FEA tools Excellent documentation and communication skills Excellent...

Lugar: Irvine, CA | 11/12/2025 20:12:27 PM | Salario: S/. No Especificado | Empresa: BD

Eng Sr Prin - Mech

with mechanical engineering tools for design and analysis, including ANSYS Workbench/Mechanical, PTC Creo, MATLAB/Simulink, Siemens NX..., ANSYS Icepak Familiarity with design, analysis, and manufacturing standards associated with complex multilayer rigid...

Lugar: Merrimack, NH | 11/12/2025 19:12:43 PM | Salario: S/. No Especificado | Empresa: BAE Systems