Principal Reliability/FA Engineer

components including semiconductor devices, surface-mount components, printed circuit boards, and wire-bond and flip-chip modules..., as is experience in mechanical polishing and sample preparation. Knowledge of IC packaging technologies (e.g., wire bond, flip-chip...

Lugar: Newbury Park, CA | 29/05/2026 21:05:55 PM | Salario: S/. $129400 - 247800 per year | Empresa: Skyworks

Principal Reliability/FA Engineer

, printed circuit boards, and wire-bond and flip-chip modules. Design and execute parametric, RF, and system-level test... packaging technologies (e.g., wire bond, flip-chip, molding) is preferred, with exposure to advanced packaging and emerging...

Lugar: Newbury Park, CA | 29/05/2026 17:05:50 PM | Salario: S/. $129400 - 247800 per year | Empresa: Skyworks

Medical Specialist 2

such as the U.S. Savings Bond and the College Savings Plan. Voluntary pre-tax savings programs such as Health Care Spending...

Lugar: Cattaraugus, NY | 23/05/2026 00:05:38 AM | Salario: S/. $244235 per year | Empresa: New York State