Director of Data Engineering

into scalable, high-impact data solutions Build and align teams through resource planning, team member allocation, and staffing...(k) with match Employee Assistance Program Paid Parental Bonding Benefit Program Flexible Paid Time Off (PTO): We believe time...

Lugar: Charlotte, NC | 14/01/2026 23:01:38 PM | Salario: S/. $145000 - 250000 per year | Empresa: Red Ventures

R&D Analytical Chemistry Manager

and solutions for the manufacturing of wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panel... applications and chemicals analyzers for metallization, cleaning and etching solutions. Improving product differentiation...

Lugar: Totowa, NJ | 18/11/2025 21:11:47 PM | Salario: S/. $146700 - 249400 per year | Empresa: KLA Corporation

Portfolio Specialist: NC2

educate your customers at a deep technical level, demonstrate, and prove our solutions, to achieve/exceed quarterly Nutanix... secure, scalable, hybrid and multi-cloud solutions that solve real business challenges. Working as a core member of the...

Lugar: USA | 29/01/2026 23:01:15 PM | Salario: S/. $248400 per year | Empresa: Nutanix

Electrical Design Engineer (Linux, Firmware, Embedded, C++)

and solutions for the manufacturing of wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panel... including an employee assistance program (EAP), paid time off and paid company holidays, and family care and bonding leave...

Lugar: Milpitas, CA | 22/01/2026 03:01:55 AM | Salario: S/. $141300 - 240200 per year | Empresa: KLA Corporation

Sr. Mechatronic Engineer, Digital Signal Processing (DSP)

and solutions for the manufacturing of wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panel... assistance program (EAP), paid time off and paid company holidays, and family care and bonding leave. Interns are eligible...

Lugar: Milpitas, CA | 09/01/2026 02:01:02 AM | Salario: S/. $141300 - 240200 per year | Empresa: KLA Corporation

Division Applications Engineer - Laser Scan

and solutions for the manufacturing of wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panel... assistance program (EAP), paid time off and paid company holidays, and family care and bonding leave. Interns are eligible...

Lugar: Milpitas, CA | 29/01/2026 22:01:16 PM | Salario: S/. $140000 - 238000 per year | Empresa: KLA Corporation

Staff Product Manager, Buyer Experience & Storefront

collaboration, and deliver customer-centric solutions aligned with Xometry's mission and growth objectives. Responsibilities... and fixed holidays, maternity and bonding leave;EAP, other wellbeing resources;and much more. #LI-Hybrid Xometry...

Lugar: North Bethesda, MD | 25/01/2026 01:01:46 AM | Salario: S/. $180000 - 234000 per year | Empresa: Xometry

Staff Product Manager, Buyer Experience & Storefront

collaboration, and deliver customer-centric solutions aligned with Xometry's mission and growth objectives. Responsibilities... and fixed holidays, maternity and bonding leave;EAP, other wellbeing resources;and much more. #LI-Hybrid Xometry...

Lugar: Waltham, MA | 24/01/2026 23:01:06 PM | Salario: S/. $180000 - 234000 per year | Empresa: Xometry