Electrical Engineer Intern D (Rochester, NY)

advanced electronics packaging and MEMS technology Experience with high density interconnect and semiconductor packaging... Perform analyses to show compliance to optical requirements and specifications for imaging systems, assemblies, component...

Lugar: Rochester, NY | 29/08/2024 23:08:44 PM | Salario: S/. No Especificado | Empresa: L3Harris Technologies

Electrical Engineer Intern D (Rochester, NY)

advanced electronics packaging and MEMS technology Experience with high density interconnect and semiconductor packaging... Perform analyses to show compliance to optical requirements and specifications for imaging systems, assemblies, component...

Lugar: Rochester, NY | 29/08/2024 23:08:06 PM | Salario: S/. No Especificado | Empresa: L3Harris Technologies

Electrical Engineer Intern D (Rochester, NY)

advanced electronics packaging and MEMS technology Experience with high density interconnect and semiconductor packaging... Perform analyses to show compliance to optical requirements and specifications for imaging systems, assemblies, component...

Lugar: Rochester, NY | 29/08/2024 22:08:33 PM | Salario: S/. No Especificado | Empresa: L3Harris Technologies

Electrical Engineer Intern D (Rochester, NY)

advanced electronics packaging and MEMS technology Experience with high density interconnect and semiconductor packaging... Perform analyses to show compliance to optical requirements and specifications for imaging systems, assemblies, component...

Lugar: Rochester, NY | 29/08/2024 22:08:14 PM | Salario: S/. No Especificado | Empresa: L3Harris Technologies

Electrical Engineer Intern D (Rochester, NY)

advanced electronics packaging and MEMS technology Experience with high density interconnect and semiconductor packaging... Perform analyses to show compliance to optical requirements and specifications for imaging systems, assemblies, component...

Lugar: Rochester, NY | 29/08/2024 22:08:12 PM | Salario: S/. No Especificado | Empresa: L3Harris Technologies

Electrical Engineer Intern D (Rochester, NY)

advanced electronics packaging and MEMS technology Experience with high density interconnect and semiconductor packaging... Perform analyses to show compliance to optical requirements and specifications for imaging systems, assemblies, component...

Lugar: Rochester, NY | 29/08/2024 22:08:12 PM | Salario: S/. No Especificado | Empresa: L3Harris Technologies

Electrical Engineer Intern D (Columbia, MD)

advanced electronics packaging and MEMS technology Experience with high density interconnect and semiconductor packaging... Perform analyses to show compliance to optical requirements and specifications for imaging systems, assemblies, component...

Lugar: Rochester, NY | 29/08/2024 20:08:41 PM | Salario: S/. No Especificado | Empresa: L3Harris Technologies

Electrical Engineer Intern C (Rochester, NY)

advanced electronics packaging and MEMS technology Experience with high density interconnect and semiconductor packaging... Perform analyses to show compliance to optical requirements and specifications for imaging systems, assemblies, component...

Lugar: Rochester, NY | 29/08/2024 20:08:51 PM | Salario: S/. No Especificado | Empresa: L3Harris Technologies

Electrical Engineer Intern D (Rochester, NY)

advanced electronics packaging and MEMS technology Experience with high density interconnect and semiconductor packaging... Perform analyses to show compliance to optical requirements and specifications for imaging systems, assemblies, component...

Lugar: Rochester, NY | 29/08/2024 19:08:27 PM | Salario: S/. No Especificado | Empresa: L3Harris Technologies