AI Engineer (Computer Vision/Signal Processing)

program (EAP), paid time off and paid company holidays, and familycare and bonding leave. Interns are eligible... and solutions for the manufacturing of wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panel...

Lugar: Milpitas, CA | 25/08/2026 22:08:35 PM | Salario: S/. $136300 - 231700 per year | Empresa: KLA Corporation

Software Engineer

off and paid company holidays, and familycare and bonding leave. Interns are eligible for some of the benefits listed... and solutions for the manufacturing of wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panel...

Lugar: Milpitas, CA | 21/08/2026 23:08:52 PM | Salario: S/. $136300 - 231700 per year | Empresa: KLA Corporation

Algorithm Engineer - Deep Learning

including an employee assistance program (EAP), paid time off and paid company holidays, and familycare and bonding leave... and solutions for the manufacturing of wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panel...

Lugar: Milpitas, CA | 21/08/2026 22:08:22 PM | Salario: S/. $136300 - 231700 per year | Empresa: KLA Corporation

Senior Software Engineer, Customer Escalations

program (EAP), paid time off and paid company holidays, and familycare and bonding leave. Interns are eligible... and solutions for the manufacturing of wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panel...

Lugar: Milpitas, CA | 21/08/2026 17:08:39 PM | Salario: S/. $136300 - 231700 per year | Empresa: KLA Corporation

Electron Beam Systems Engineer – SEM / Metrology

including an employee assistance program (EAP), paid time off and paid company holidays, and familycare and bonding leave... and solutions for the manufacturing of wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panel...

Lugar: Milpitas, CA | 13/08/2026 20:08:20 PM | Salario: S/. $136300 - 231700 per year | Empresa: KLA Corporation

Embedded Software Engineer (C/C++ | Micro Controller)

including an employee assistance program (EAP), paid time off and paid company holidays, and familycare and bonding leave... and solutions for the manufacturing of wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panel...

Lugar: Milpitas, CA | 13/08/2026 02:08:15 AM | Salario: S/. $136300 - 231700 per year | Empresa: KLA Corporation

Embedded Software Engineer (C/C++ | Motion Controller)

including an employee assistance program (EAP), paid time off and paid company holidays, and familycare and bonding leave... and solutions for the manufacturing of wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panel...

Lugar: Milpitas, CA | 12/08/2026 18:08:42 PM | Salario: S/. $136300 - 231700 per year | Empresa: KLA Corporation

System Design Engineer

including an employee assistance program (EAP), paid time off and paid company holidays, and familycare and bonding leave... and solutions for the manufacturing of wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panel...

Lugar: Milpitas, CA | 11/08/2026 21:08:17 PM | Salario: S/. $136300 - 231700 per year | Empresa: KLA Corporation

Senior Algorithm Engineer

including an employee assistance program (EAP), paid time off and paid company holidays, and familycare and bonding leave... and solutions for the manufacturing of wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panel...

Lugar: Milpitas, CA | 06/08/2026 00:08:45 AM | Salario: S/. $136300 - 231700 per year | Empresa: KLA Corporation