are changing the way the world communicates. Requisition ID: 78373 Description Join Skyworks' Advanced IC Packaging team... models (FEM) of IC packages to evaluate stress, strain, and deformation induced by package assembly processes, ensuring...
Lugar:
Irvine, CA | 13/10/2026 17:10:37 PM | Salario: S/. $114400 - 220200 per year | Empresa:
Skyworks Search Jobs Search Jobs Job Description Job Title: Advanced IC Packaging - Staff Engineer Posting Start Date: 9/8/26... Job Description: Description Join Skyworks' Advanced IC Packaging team and play a key role in developing advanced semiconductor packaging technologies...
Lugar:
Irvine, CA | 09/09/2026 17:09:14 PM | Salario: S/. $114400 - 220200 per year | Empresa:
Skyworks are changing the way the world communicates. Requisition ID: 78372 Description Join Skyworks' Advanced IC Packaging team... models (FEM) of IC packages to evaluate stress, strain, and deformation induced by package assembly processes, ensuring...
Lugar:
Irvine, CA | 13/10/2026 17:10:40 PM | Salario: S/. $114400 - 220200 per year | Empresa:
Skyworks entire IC, doing and/or supervising physical layout, verifying circuit and chip-level operation and performance...
Lugar:
Nashua, NH | 13/10/2026 17:10:32 PM | Salario: S/. $114400 - 220200 per year | Empresa:
Skyworks in PCB and IC design tools and RF/parametric test equipment. Exceptional analytical, problem-solving, and communication.... Knowledge of IC packaging technologies, including wire-bond, flip-chip, and molding processes, is preferred. Familiarity...
provides system and application-level expertise to the IC design, software, firmware, validation and application engineering...
Lugar:
Austin, TX | 13/10/2026 17:10:24 PM | Salario: S/. $114400 - 220200 per year | Empresa:
Skyworks are changing the way the world communicates. Requisition ID: 77946 Description Seeking an experienced Analog IC design... models of blocks and the entire IC, doing and/or supervising physical layout, verifying circuit and chip-level operation...
Lugar:
Austin, TX | 13/10/2026 17:10:14 PM | Salario: S/. $114400 - 220200 per year | Empresa:
Skyworks are changing the way the world communicates. Requisition ID: 78371 Description Join Skyworks' Advanced IC Packaging team... models (FEM) of IC packages to evaluate stress, strain, and deformation induced by package assembly processes, ensuring...
Lugar:
Irvine, CA | 13/10/2026 17:10:59 PM | Salario: S/. $114400 - 220200 per year | Empresa:
Skyworks in PCB and IC design tools and RF/parametric test equipment. Exceptional analytical, problem-solving, and communication.... Knowledge of IC packaging technologies, including wire-bond, flip-chip, and molding processes, is preferred. Familiarity...
are changing the way the world communicates. Requisition ID: 78372 Job Description: Description Join Skyworks' Advanced IC... detailed thermo-mechanical finite element models (FEM) of IC packages to evaluate stress, strain, and deformation induced...
Lugar:
Irvine, CA | 10/09/2026 21:09:28 PM | Salario: S/. $114400 - 220200 per year | Empresa:
Skyworks