R&D Engineer IC Design

This opening work on chip design which enables 10Gbps/40Gbps/100Gbps/400Gbps backplane/cable/optical fiber communication and 5G transciever prepare detailed design document HDL coding, equivalency checking, STA result review, CDC checks...

Lugar: Irvine, CA | 03/12/2025 21:12:31 PM | Salario: S/. $73000 - 117000 per year | Empresa: Broadcom

R&D Engineer IC Design 3

Job Description: This opening work on chip design which enables 100Gbps/200Gbps/400Gbps optical fiber communication prepare detailed design document HDL coding, equivalency checking, STA result review, CDC checks, Lint checks, RTL/gat...

Lugar: Irvine, CA | 03/12/2025 18:12:12 PM | Salario: S/. $91000 - 146000 per year | Empresa: Broadcom

IC / Semiconductor Package Designer

IC / Semiconductor Package Designer Role Overview We are seeking an experienced IC Packaging Engineer to drive next-generation package architecture, design, and productization using advanced node silicon (7nm, 5nm, 3nm and beyond). This...

Lugar: San Jose, CA | 03/12/2025 00:12:18 AM | Salario: S/. $120000 - 192000 per year | Empresa: Broadcom

Manager, FInOps (IC)

At CVS Health, we’re building a world of health around every consumer and surrounding ourselves with dedicated colleagues who are passionate about transforming health care. As the nation’s leading health solutions company, we reach millio...

Lugar: Northbrook, IL | 02/12/2025 21:12:56 PM | Salario: S/. $60300 - 145860 per year | Empresa: CVS Health

Digital IC Principal Design Engineer

About Marvell Marvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, our innovative technology is enabling new po...

Lugar: Santa Clara, CA | 02/12/2025 20:12:48 PM | Salario: S/. $146850 - 220000 per year | Empresa: Marvell

IC Package Mechanical FEA Engineer (R&D)

Broadcom is seeking an experienced package mechanical FEA engineer for very-large and complex packages for industry-leading ASICs. You will be part of a worldwide R&D team developing high-performance package designs for ASICs for artificial...

Lugar: Fort Collins, CO | 02/12/2025 20:12:00 PM | Salario: S/. No Especificado | Empresa: Broadcom