Mechanical Engineering Internship – Summer 2026
Company: Qualcomm Technologies, Inc. Job Area: Interns Group, Interns Group Interim Engineering Intern - HW... of Materials, and Finite Element Analysis (FEA) Knowledge of IC packaging structures, chip-package interaction, and electronic...
Lugar: San Diego, CA | 18/10/2025 22:10:33 PM | Salario: S/. No Especificado | Empresa: Qualcomm