Packaging Module Development Engineer

technology and foundry capabilities by: • Developing thermal interface technology and material solutions to support Intel...

Lugar: Phoenix, AZ | 21/07/2026 17:07:29 PM | Salario: S/. $99030 - 188890 per year | Empresa: Intel

COUPAR: Interior Design Assistant

, Designer Link, Ivy, and Harvest time input and order tracking â— Organize and maintain client FF&E binders â— Interface...

Lugar: Reno, NV | 20/07/2026 17:07:12 PM | Salario: S/. $25 - 28 per hour | Empresa: COUPAR