IC Package Mechanical FEA Engineer (R&D)
and mainstream flip-chip BGA (FCBGA) packages. You'll have the opportunity to collaborate with the R&D and manufacturing teams... to influence the mechanical design of new ASICs, and make engineering trade offs with warpage, stress, reliability, cost, thermal...
Lugar: Fort Collins, CO | 03/12/2025 00:12:22 AM | Salario: S/. No Especificado | Empresa: Broadcom