Principal IC Packaging Engineer

in 2.5D/3D for high-density die-to-die (D2D) interconnects, RDL, fan-out bridges, FCBGA, MCM, and related disciplines... with disabilities. We will not respond here to requests for updates on applications or resume inquiries). To all Staffing...

Lugar: San Diego, CA | 10/12/2025 00:12:28 AM | Salario: S/. No Especificado | Empresa: Qualcomm