Packaging Engineer

.S Job Description ● Development engineering for MEMS packages ● Package design and Development of assembly process for MEMS devices in co-operation...

Lugar: Mount Prospect, IL | 13/02/2025 03:02:49 AM | Salario: S/. $95000 - 110000 per year | Empresa: Bosch

Director of Technology

, etc.), leveraging one or more semiconductor technologies including but not limited to CMOS ASIC, MEMS, More-than-Moore micro-/nano...

Lugar: Boston, MA | 12/02/2025 18:02:12 PM | Salario: S/. No Especificado | Empresa: Stemta Corporation

Packaging Engineer

.S Job Description ● Development engineering for MEMS packages ● Package design and Development of assembly process for MEMS devices in co-operation...

Lugar: Mount Prospect, IL | 12/02/2025 18:02:46 PM | Salario: S/. $95000 - 110000 per year | Empresa: Bosch