Packaging Module Development Engineer
of America) Primary Location: US, Arizona, Phoenix Additional Locations: Business group: Intel Foundry strives to make..., including stamping and CNC machining. Understanding of semiconductor fabrication processes and packaging technologies...
Lugar: Phoenix, AZ | 04/06/2026 00:06:00 AM | Salario: S/. $115110 - 162500 per year | Empresa: Intel