ABOUT THE ROLE PowerProbe is bringing manufacturing back to the U.S. and building a new electronics manufacturing... in a growing electronics manufacturing operation. PowerProbe is bringing manufacturing back to the U.S. and we need a Line Leader...
group and will primarily share work assignments within their job grouping with no inherent or “system imposed” limits. Based... to Aerosol Generator (Laskin nozzle or Thermal), Aerosol Photometer with scanning wand and probe, Anemometer (Rotary Vane or Hot...
Lugar:
West Point, PA | 26/06/2026 19:06:51 PM | Salario: S/. No Especificado | Empresa:
MSD## Company: Qualcomm Technologies, Inc. ## Job Area: Operations Group, Operations Group >Supply Chain...-fab semiconductor manufacturing processes, including Bump, Probe, BE2, Assembly and Final Test. This role requires...
Lugar:
San Diego, CA | 26/06/2026 18:06:06 PM | Salario: S/. $118400 - 177600 per year | Empresa:
Qualcomm and solutions to PCB and package layout based on Signal Integrity. Support the probe card development within the Design Group...Job Description: Employer: FormFactor, Inc. Position: Signal Integrity Engineer Duties: Improve Signal Integrity...
and advance faster than ever. As a Custom HBM Physical Design Engineer in the Heterogeneous Integration Group (HIG... (performance, power, area) and robust signoff collateral for tapeout. This is a hands‑on role with opportunities to own blocks...
ever. As a Custom HBM Architecture and Design Engineer, you will be part of the Heterogeneous Integration Group (HIG), contributing... solutions that meet ambitious power, performance, area, and schedule targets. This is a hands-on technical role for candidates...
to use a variety of test equipment such as Simpson meter, amp probe, oscilloscope, signal generators, programmable power... supplies and multimeters. Provide training and diagnostic assistance for other personnel in work group as needed. Install new...
Req ID: JR89363 New College Grad - Semiconductor Design Engineer, DRAM Products Group Our vision is to transform..., address decode, datapaths, and internal test logic. Evaluate architectural tradeoffs and understand impacts on power...
Lugar:
Boise, ID | 09/06/2026 22:06:08 PM | Salario: S/. No Especificado | Empresa:
Micron Physical Design Engineer in the Heterogeneous Integration Group (HIG), you will drive the implementation of advanced HBM SoC..., packaging/assembly, and manufacturing teams to deliver best‑in‑class PPA (performance, power, area) and robust signoff...
Engineering, Test, Probe, Process Integration, Assembly and Marketing to proactively design HBM products that optimize... all manufacturing functions and assure the best performance, power, cost, quality, reliability, time-to-market, and customer...