Advanced Packaging Process Engineer III (E3)

personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our . Role... characterization on a variety of difficult systems Troubleshoot complex problems, perform Root Cause Analysis, and resolve a variety...

Lugar: Santa Clara, CA | 30/09/2026 18:09:42 PM | Salario: S/. $124000 - 171000 per year | Empresa: Applied Materials

Senior Electronic IC Design Engineer

development, wafer fabrication, circuit design, advanced packaging, systems architecture and applications engineering..., and vision insurance. Employer-sponsored 401(k) plan. Paid time off. Professional development opportunities. EEO: MACOM...

Lugar: Milpitas, CA | 16/10/2026 17:10:48 PM | Salario: S/. $121000 - 171000 per year | Empresa: MACOM

Process Engineer, Principal

, wafer fabrication, circuit design, advanced packaging, systems architecture and applications engineering. We are committed... experience in semiconductors / Wafer fabrication process. Familiarity with typical material systems used in compound...

Lugar: Lowell, MA | 27/08/2026 01:08:48 AM | Salario: S/. $117000 - 171000 per year | Empresa: MACOM

Manager, Data Enablement

Company Overview Why Choose Us? Novolex is a leading manufacturer of food, beverage, and specialty packaging... of syndicated market data and internal business data across multiple systems and business units, transforming complex data...

Lugar: USA | 13/08/2026 18:08:28 PM | Salario: S/. $102000 - 171000 per year | Empresa: Pactiv

Mechanical Engineer (Lead Cold Box Packaging)

oversight for the design, packaging, integration, and delivery of cold box systems supporting the company’s clean energy... packaged systems. The position is designed to serve as the knowledge expert in Cold Box Packaging in addition to basic...

Lugar: Escondido, CA | 10/10/2026 23:10:32 PM | Salario: S/. $91128 - 170032 per year | Empresa: Nikkiso

Mechanical Engineer (Lead Cold Box Packaging)

technical leadership and engineering oversight for the design, packaging, integration, and delivery of cold box systems... essential functions. · Lead the engineering development of cold box packagingsystems from concept through final delivery...

Lugar: Escondido, CA | 10/10/2026 18:10:00 PM | Salario: S/. $91128 - 170032 per year | Empresa: Nikkiso

EverPro - Lead Product Manager

and commercialization of voice offerings across EverPro, including packaging, positioning, enablement, and expansion opportunities...-to-market teams to define target customers, packaging, pricing inputs, sales enablement, launch sequencing, and expansion...

Lugar: Denver, CO | 24/09/2026 21:09:40 PM | Salario: S/. $170000 per year | Empresa: EverCommerce

Senior HR Business Partner

, wafer fabrication, circuit design, advanced packaging, systems architecture and applications engineering. We are committed... ability to quickly learn the organization's HRIS/HCM and talent management systems. Education and Experience: Bachelor...

Lugar: Morgan Hill, CA | 02/09/2026 01:09:02 AM | Salario: S/. $146000 - 170000 per year | Empresa: MACOM