Senior Microelectronics Design Engineer

, directed energy systems, high speed/hypersonic weapon systems, communications/networking systems, and related technologies..., EMIB), chip attach (epoxy, solder), chip interconnect (chiplet, flipchip, wire/ribbon bonding), modeling & simulation...

Lugar: El Cajon, CA | 24/11/2024 03:11:15 AM | Salario: S/. No Especificado | Empresa: Leidos

Senior Microelectronics Design Engineer

, directed energy systems, high speed/hypersonic weapon systems, communications/networking systems, and related technologies..., EMIB), chip attach (epoxy, solder), chip interconnect (chiplet, flipchip, wire/ribbon bonding), modeling & simulation...

Lugar: La Jolla, CA | 24/11/2024 03:11:11 AM | Salario: S/. No Especificado | Empresa: Leidos

Senior Microelectronics Design Engineer

, directed energy systems, high speed/hypersonic weapon systems, communications/networking systems, and related technologies..., EMIB), chip attach (epoxy, solder), chip interconnect (chiplet, flipchip, wire/ribbon bonding), modeling & simulation...

Lugar: National City, CA | 24/11/2024 03:11:32 AM | Salario: S/. No Especificado | Empresa: Leidos

Senior Microelectronics Design Engineer

, directed energy systems, high speed/hypersonic weapon systems, communications/networking systems, and related technologies..., EMIB), chip attach (epoxy, solder), chip interconnect (chiplet, flipchip, wire/ribbon bonding), modeling & simulation...

Lugar: Chula Vista, CA | 24/11/2024 03:11:22 AM | Salario: S/. No Especificado | Empresa: Leidos

Senior Microelectronics Design Engineer

, directed energy systems, high speed/hypersonic weapon systems, communications/networking systems, and related technologies..., EMIB), chip attach (epoxy, solder), chip interconnect (chiplet, flipchip, wire/ribbon bonding), modeling & simulation...

Lugar: Arlington, VA | 24/11/2024 03:11:53 AM | Salario: S/. No Especificado | Empresa: Leidos

Senior Microelectronics Design Engineer

, directed energy systems, high speed/hypersonic weapon systems, communications/networking systems, and related technologies..., EMIB), chip attach (epoxy, solder), chip interconnect (chiplet, flipchip, wire/ribbon bonding), modeling & simulation...

Lugar: Rancho Santa Fe, CA | 24/11/2024 03:11:26 AM | Salario: S/. No Especificado | Empresa: Leidos

Senior Microelectronics Design Engineer

, directed energy systems, high speed/hypersonic weapon systems, communications/networking systems, and related technologies..., EMIB), chip attach (epoxy, solder), chip interconnect (chiplet, flipchip, wire/ribbon bonding), modeling & simulation...

Lugar: Cardiff By The Sea, CA | 24/11/2024 03:11:00 AM | Salario: S/. No Especificado | Empresa: Leidos

Senior Microelectronics Design Engineer

systems, high speed/hypersonic weapon systems, communications/networking systems, and related technologies for our nation..., EMIB), chip attach (epoxy, solder), chip interconnect (chiplet, flipchip, wire/ribbon bonding), modeling & simulation...

Lugar: San Diego, CA | 24/11/2024 00:11:02 AM | Salario: S/. No Especificado | Empresa: Leidos

Fiber Splicer - Communications

, AND OPTI-SPLICE LID FUSION SLICERS) Single and ribbon splicing Cable & enclosure prep: bonding & grounding of all cables when... team setting and provide role model leadership to Aspire Communications workforce Qualifications and Experience Valid...

Lugar: Atlanta, GA | 14/11/2024 22:11:26 PM | Salario: S/. No Especificado | Empresa: Primoris Services Corporation

Senior Public Relations Specialist

Location: Open to Portland, ME or Boston, MA Overview: Provide support and counsel on external communications... strategy to regional leaders and key stakeholders across the company. Develop and implement communications programs...

Lugar: Portland, ME | 14/11/2024 01:11:10 AM | Salario: S/. $71985.72 - 119976.2 per year | Empresa: M&T Bank