3D Memory Chip Architect and Design, Principal Engineer

## Company: Qualcomm Technologies, Inc. ## Job Area: Engineering Group, Engineering Group >ASICS Engineering... - and this is where you come in. The Qualcomm Custom Memory Team in Process & Package Solutions Group has an opening in the areas of 3D Memory Design...

Lugar: Hillsboro, OR | 26/06/2026 18:06:00 PM | Salario: S/. No Especificado | Empresa: Qualcomm