Semiconductor Packaging Mechanical Engineer

. Strong understanding of advanced packaging technologies, familiarity with semiconductor packaging processes, including die attach.... Job Type: College Grad Shift: Shift 1 (United States of America) Primary Location: US, Arizona, Phoenix Additional Locations...

Lugar: Chandler, AZ | 25/02/2026 23:02:25 PM | Salario: S/. No Especificado | Empresa: Intel

Intern - Manufacturing Engineering (Summer 2026)

to work in the United States. Verification of employment eligibility will be required at the time of hire. Visa sponsorship... is not available for this position. About Us: Howmet Aerospace Inc. (NYSE: HWM), headquartered in Pittsburgh, Pennsylvania, is a leading global...

Lugar: Cleveland, OH | 25/02/2026 23:02:40 PM | Salario: S/. No Especificado | Empresa: Howmet Aerospace

Software Engineer Intern

-Wehmiller companies — Paper Converting Machine Company (PCMC), Winkler + Dünnebier (W+D), STAX Technologies, Hudson-Sharp..., Baldwin Technologies and Northern Engraving and Machine. These industry leaders offer trusted brands and innovative...

Lugar: Green Bay, WI | 25/02/2026 22:02:12 PM | Salario: S/. No Especificado | Empresa: Barry-Wehmiller

Optical Engineer (coherent) Intern

on average 2 days per week from an HPE office. Who We Are: Hewlett Packard Enterprise is the global edge-to-cloud company... and/or fiber-optic communication systems technology. Knowledge & Skills: Background in system technologies applied to advanced...

Lugar: Sunnyvale, CA | 25/02/2026 22:02:06 PM | Salario: S/. No Especificado | Empresa: Hewlett Packard Enterprise