LTD BE Etch Module Development Engineer

, and qualification activities for Back End Etch modules. Contribute to the development of next‑generation patterning processes;execute...

Lugar: Hillsboro, OR | 25/03/2026 19:03:18 PM | Salario: S/. $115110 - 162500 per year | Empresa: Intel

Packaging Module Equipment Development Engineer

Job Details: Job Description: The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile, edge, a...

Lugar: Phoenix, AZ | 01/04/2026 17:04:05 PM | Salario: S/. $120860 - 170630 per year | Empresa: Intel

Module Development Engineer

Job Details: Job Description: TD Module Development Engineers are responsible for leading scientific research enabling the manufacture of innovative device architectures but not limited to: Drives technology development and enablement...

Lugar: Hillsboro, OR | 28/03/2026 03:03:34 AM | Salario: S/. No Especificado | Empresa: Intel

Module Development Engineer

Job Details: Job Description: Join Intel - and build a better tomorrow. Intel is in the midst of an exciting transformation, with a vision to create and extend computing technology to connect and enrich the lives of every person on Eart...

Lugar: Hillsboro, OR | 22/03/2026 19:03:02 PM | Salario: S/. $133800 - 188890 per year | Empresa: Intel

Module Development Engineer

Job Details: Job Description: Embark with us on a journey of growth and transformation as we create exceptionally engineered technology and bring AI everywhere. As a valued team member, your adaptability and attention to detail will con...

Lugar: Hillsboro, OR | 20/03/2026 19:03:43 PM | Salario: S/. $133800 - 188890 per year | Empresa: Intel

Test Module Development Engineer

Job Details: Job Description: Intel's Advanced Packaging Technology Manufacturing (APTM) group is a critical division driving the next generation of semiconductor packaging solutions. The team focuses on groundbreaking technologies that...

Lugar: Phoenix, AZ | 20/03/2026 00:03:38 AM | Salario: S/. $133800 - 188890 per year | Empresa: Intel

Fab Module Engineer

Job Details: Job Description: Join Intel and build a better tomorrow. Our exciting vision: Extend computing technology to connect and enrich the lives of every person on earth. Join us as we create the next generation of technologie...

Lugar: Hillsboro, OR | 17/03/2026 18:03:48 PM | Salario: S/. $76390 - 107840 per year | Empresa: Intel