Jr. Customer Service Representative

Avance en su carrera en Ball, líder mundial en la fabricación de envases de aluminio sostenibles. ¡Logre cosas...! ¡Ball está encantada de recibir el premio de Newsweek de Top 100 Global Most Loved Workplace 2023! Como líder en productos...

Lugar: San Luis Potosí, S.L.P. | 13/11/2024 22:11:11 PM | Salario: S/. No Especificado | Empresa: Ball Corporation

Advance Packaging Technology Development Engineer

. Actual experience with TCB (Thermal Compression Bonding), CMP (Chemical Mechanical Polish), and Ball Mount is a plus. Finally, hands... molding, wafer level ball mount, TCB, FC, UF, Hybrid bond, Glass carrier bond/ de-bond.Problem-Solving Abilities...

Lugar: Jalisco | 26/12/2024 18:12:15 PM | Salario: S/. No Especificado | Empresa: Micron Technology, Inc

Advance Packaging Technology Development Engineer

is required. Actual experience with TCB (Thermal Compression Bonding), CMP (Chemical Mechanical Polish), and Ball Mount is a plus. Finally, hands... molding, wafer level ball mount, TCB, FC, UF, Hybrid bond, Glass carrier bond/de-bond.Problem-Solving Abilities...

Lugar: Jalisco | 26/12/2024 18:12:37 PM | Salario: S/. No Especificado | Empresa: Micron Technology, Inc

Key Account Manager Liverpool

;step up when you see a need..OWNERSHIP: Pick up the ball. Be proactive, take responsibility and follow-through.INNOVATION...

Lugar: Veracruz, Ver. | 26/12/2024 18:12:15 PM | Salario: S/. No Especificado | Empresa: Adidas

Advance Packaging Technology Development Engineer

is required. Actual experience with TCB (Thermal Compression Bonding), CMP (Chemical Mechanical Polish), and Ball Mount is a plus. Finally, hands... molding, wafer level ball mount, TCB, FC, UF, Hybrid bond, Glass carrier bond/de-bond.Problem-Solving Abilities...

Lugar: Jalisco | 26/12/2024 18:12:11 PM | Salario: S/. No Especificado | Empresa: Micron Technology, Inc

Advance Packaging Technology Development Engineer

. Actual experience with TCB (Thermal Compression Bonding), CMP (Chemical Mechanical Polish), and Ball Mount is a plus. Finally, hands..., CVD, CMP, wafer level molding, wafer level ball mount, TCB, FC, UF, Hybrid bond, Glass carrier bond/ de-bond.Problem...

Lugar: Jalisco | 26/12/2024 18:12:26 PM | Salario: S/. No Especificado | Empresa: Micron Technology, Inc