Principal Engineer Microelectronic Semiconductors

-end post-processing to ensure satisfactory integration of under bump metallization and sphere drop processes into overall... Strong understanding of vacuum technology, thin-film stress, adhesion, uniformity, and contamination control Experience with under bump...

Lugar: Apopka, FL | 24/12/2025 18:12:05 PM | Salario: S/. $98400 - 147600 per year | Empresa: Northrop Grumman

CAD Designer

shoes, bump caps, gloves, hair nets, masks, & clean-room frocks while adhering to the prescribed safety procedures....

Lugar: Austin, TX | 07/01/2026 18:01:40 PM | Salario: S/. $90000 - 110000 per year | Empresa: CelLink Corp

Package Design Engineer

requirements). · Incorporate assembly rules (die placement, bump/ball pitch, solder joint reliability, warpage control...) into package designs. · Develop and validate Flip Chip package designs, including bump assignment, redistribution layers (RDL...

Lugar: San Jose, CA | 14/11/2025 22:11:36 PM | Salario: S/. $73000 - 110000 per year | Empresa: UST