IC / Semiconductor Package Designer

-leading package solutions. The ideal candidate has deep technical expertise in substrate design, floor-planning, bump... floorplan, die bump patterns, and IO architecture for advanced node products. Co-optimize package stack-up, layer count...

Lugar: San Jose, CA | 02/12/2025 18:12:07 PM | Salario: S/. $120000 - 192000 per year | Empresa: Broadcom

R&D Engineer IC Design

designs. You will be working on designing interposers starting with custom routing for high speed interfaces, bump map design.... Strong automation expertise related to bump pattern generation , routing structure development for high speed interfaces, and chip...

Lugar: San Jose, CA | 20/11/2025 02:11:19 AM | Salario: S/. $120000 - 192000 per year | Empresa: Broadcom

Manager, Maintenance

use of a bump cap and eye protection is required. Saputo is an Equal Opportunity Employer. All qualified applicants...

Lugar: Tulare, CA | 23/12/2025 18:12:47 PM | Salario: S/. $104730 - 157090 per year | Empresa: Saputo