IC / Semiconductor Package Designer

-leading package solutions. The ideal candidate has deep technical expertise in substrate design, floor-planning, bump... floorplan, die bump patterns, and IO architecture for advanced node products. Co-optimize package stack-up, layer count...

Lugar: San Jose, CA | 03/12/2025 02:12:43 AM | Salario: S/. $120000 - 192000 per year | Empresa: Broadcom

Class A CDL OTR Driver

: No. Bonus: N/A. Note: Multi stop deliveries. Deliveries are usually to job sites or remodels. Sometimes you won't bump...

Lugar: Oregon | 28/11/2025 18:11:42 PM | Salario: S/. $1500 - 2000 mensual | Empresa: DriveLine Solutions

Production General Manager

is a possibility and may include equipment such as a full Tyvek suit, safety shoes, gloves, safety glasses, face mask, bump cap...

Lugar: Sparks, NV | 26/11/2025 23:11:12 PM | Salario: S/. No Especificado