Analog Engineer

, and implement analog circuits and mixed-signal IPs, including ADCs, DACs, voltage regulators, and high-speed I/O interfaces... state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology...

Lugar: Hillsboro, OR | 16/06/2026 17:06:42 PM | Salario: S/. No Especificado | Empresa: Intel

Silicon Packaging Design Engineer

customers globally. Foundry Services will be differentiated from other foundries with a combination of leading-edge packaging... and RISC-V ecosystem IPs. Foundry Services will also provide access to silicon design services to help our customers seamlessly...

Lugar: Chandler, AZ | 14/06/2026 21:06:23 PM | Salario: S/. $105650 - 172860 per year | Empresa: Intel

Physical Design Methodology Engineer

IPs, RF/mm Wave circuits and 3D IC, and conducts comprehensive Si validation on process and package development test... to guide silicon and packaging technology definition to maximize technology PPA entitlement and minimize process risks and cost...

Lugar: Hillsboro, OR | 12/06/2026 00:06:30 AM | Salario: S/. No Especificado | Empresa: Intel

Senior Silicon Photonics TD Reliability Engineer

and collaborating with the SiPh fab process integration, Integrated Photonics Solutions (IPS) R&D design team, Foundry Q&R teams... while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the...

Lugar: Rio Rancho, NM | 08/06/2026 02:06:35 AM | Salario: S/. No Especificado | Empresa: Intel

Silicon Photonics TD Process/Product Integration Engineer

qualifications. Primary Responsibilities: A Process Integrator collaborates with Yield Analysis, Device and Defect Engineers, IPS... technical problems and deliver product milestones;interfacing between IPS, F11x process engineering, finance, planning, wafer...

Lugar: Albuquerque, NM | 15/05/2026 18:05:35 PM | Salario: S/. No Especificado | Empresa: Intel

Senior Principal Engineer, Chip Lead, Photonic Fabric Chiplet

into their AI accelerators and GPUs. The technology is fully compatible with both protocol and physical layers, including standard 2.5D packaging... Own the end‑to‑end product design spanning Electrical IC, Photonic IC, firmware stack, and advanced packaging design...

Lugar: Santa Clara, CA | 14/05/2026 22:05:16 PM | Salario: S/. No Especificado | Empresa: Marvell

Senior Applications and Solutions Engineer - Foundry Services

by delivering cutting-edge silicon process and packaging technology leadership for the AI era. Intel Foundry will be differentiated... x86 cores, graphics, AI, and Arm/RISC-V IPs, world-class design services, and operationally resilient global manufacturing...

Lugar: Chandler, AZ | 07/05/2026 02:05:35 AM | Salario: S/. No Especificado | Empresa: Intel