Module Development Engineer

Job Details: Job Description: Microelectronic Packaging Collateral Engineers provide project management, equipment collateral design/development, and sustaining support for integrated circuit or semiconductor assemblies, various other e...

Lugar: Hillsboro, OR | 12/08/2026 00:08:28 AM | Salario: S/. $99030 - 139810 per year | Empresa: Intel

Packaging module development engineer

Job Details: Job Description: Join Intel's Advanced Packaging Technology Development team as a Packaging Module Development Engineer. In this pivotal role you will develop and optimize cutting-edge substrate processes and equipment to e...

Lugar: Phoenix, AZ | 11/08/2026 19:08:41 PM | Salario: S/. $99030 - 188890 per year | Empresa: Intel

Senior Global Sourcing Manager - Electronic Modules

Job Description The Role As a Senior Global Sourcing Manager, you will be responsible for purchase of all or a specific portion of productive and/or non-productive materials, supplies, machinery, tooling, and/or services. You will be re...

Lugar: Warren, MI | 08/08/2026 00:08:00 AM | Salario: S/. No Especificado | Empresa: General Motors

Module Development Engineering Manager

Job Details: Job Description: The Role and Impact: Join Intel's Module Development Engineering team as a manager, where you will lead a group of talented engineers in crafting innovative solutions for next-generation technology develo...

Lugar: Hillsboro, OR | 04/08/2026 20:08:26 PM | Salario: S/. No Especificado | Empresa: Intel

Module Equipment Technician - Metrology

Job Details: Job Description: As a Module Equipment Technician working in the LTD Metrology group, you will play a vital role in maintaining manufacturing equipment to ensure smooth and efficient operations. Your hands-on expertise in t...

Lugar: Hillsboro, OR | 04/08/2026 19:08:22 PM | Salario: S/. $60450 - 85340 per year | Empresa: Intel

Packaging Module Development Engineer

Job Details: Job Description: The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile, edge, a...

Lugar: Phoenix, AZ | 31/07/2026 23:07:35 PM | Salario: S/. No Especificado | Empresa: Intel

Module Development Defect Inspection Engineer

Job Details: Job Description: Key Responsibilities The following responsibilities outline the primary duties and expectations of this role. Drives technology development and enables both high volume manufacturing and future technolog...

Lugar: Hillsboro, OR | 31/07/2026 19:07:41 PM | Salario: S/. $133800 - 188890 per year | Empresa: Intel