technologies, advanced packaging, high-speed interface architectures, and system-level design. The architect will drive key silicon... digital architecture, analog IP integration, packaging, signal integrity, power delivery, and platform design. You thrive...
. Lead cross-functional teams across digital design, verification, physical design, DFT, firmware, validation, packaging... IPs and Advanced PHY technologies. Experience with high-bandwidth and low-latency interconnect technologies. Knowledge...
. Lead cross-functional teams across digital design, verification, physical design, DFT, firmware, validation, packaging... IPs and Advanced PHY technologies. Experience with high-bandwidth and low-latency interconnect technologies. Knowledge...
and packaging solutions. Guided by our values of humility, unity, and integrity, we leverage advanced technology and innovation... of experience managing a SIEM platform Knowledge of network protocols, firewalls, IDS/IPS, EDR, cloud security logs Understanding...
such as physical design, STA, DFT, and packaging? Have you taped out so many chips that you can identify potential design problems... collaterals, design, test, packaging, fabrication, bring-up and production Advise customers on best practices in EDA, flows...
logistics support in planning, developing and executing acquisition and sustainment integrated product support (IPS... support information to support lifecycle management Assist the Government in the development, update, and review of IPS...
at power. Drive alignment on power delivery architecture, packaging infrastructure, and platform definition as it impacts... assumed power delivery margins and define new margin requirements. Drive alignment on thermal modeling, packaging & platform...
into their AI accelerators and GPUs. The technology is fully compatible with both protocol and physical layers, including standard 2.5D packaging... Own the end‑to‑end product design spanning Electrical IC, Photonic IC, firmware stack, and advanced packaging design...
and functional architectures, as well as the adoption of new semiconductor and packaging technologies. Our team collaborates closely... — spanning new architectures, clock IPs, tools, and flows. This position offers the opportunity to join a team of industry...
performance, power, and die size Specify the requirements of individual IPs used in the product Work with the project manager... to efficiently collaborate with cross-functional teams: understanding the basic digital design flow, packaging, test engineering...