Job Description Summary We are seeking a Senior Mechanical Engineer to lead the packaging, structural, and thermal..., with responsibility for developing cooling systems, enclosures, and packaging architectures for high-density power electronics operating...
Lugar:
USA | 24/05/2026 21:05:56 PM | Salario: S/. $113200 - 188800 per year | Empresa:
GE VernovaJob Description: At IPS, we are global leaders in developing innovative solutions for the consulting, architecture... reports, inspection reports, and the completion of Construction Completion Records for close-out documentation to the IPS...
Job Description: Job Description At IPS, we are global leaders in developing innovative solutions for the... for close-out documentation to the IPS Commissioning/Validation team and client. Assumes primary responsibility...
IPs for High Bandwidth Memory (HBM) products. This role is critical in developing and integrating high-performance analog..., packaging, and test teams Minimum Qualifications: MS or PhD in Electrical Engineering or related field ~10–15+ years...
Job Description: At IPS, we are global leaders in developing innovative solutions for the consulting, architecture... at client sites where they work in construction, process, packaging, manufacturing, research or other "non-administrative" areas...
Job Description: Job Description At IPS, we are global leaders in developing innovative solutions for the... where they work in construction, process, packaging, manufacturing, research or other "non-administrative" areas. All interviews...
in construction, process, packaging, manufacturing, research, or other "non-administrative" areas. #LI-JP1 About Us: IPS...Job Description: At IPS, we are global leaders in developing innovative solutions for the consulting, architecture...
into their AI accelerators and GPUs. The technology is fully compatible with both protocol and physical layers, including standard 2.5D packaging... Own the end‑to‑end product design spanning Electrical IC, Photonic IC, firmware stack, and advanced packaging design...
in construction, process, packaging, manufacturing, research, or other "non-administrative" areas. #LI-JP1 About Us IPS...Job Description: Job Description At IPS, we are global leaders in developing innovative solutions for the...
, Foundational IPs, Reference Flows, and Platform Validation to meet release commits and customer needs. This leader is responsible... our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling...
Lugar:
Hillsboro, OR | 12/05/2026 23:05:17 PM | Salario: S/. No Especificado | Empresa:
Intel