(SOCs), from architecture and design all the way through layout, packaging, prototype validation and production ramp up. The... both internal and external IPs and driving a high quality design tape-out for the CCS products. As part of SOC Design...
development, circuit design, physical design, packaging, etc., is a function team responsible of validating all Marvell HSS IPs...) develops Marvell's most advanced High-Speed SerDes (HSS) IPs covering multiple applications, Switch, Storage, Optics...
Lugar:
San Diego, CA | 16/07/2026 22:07:15 PM | Salario: S/. $152300 - 225440 per year | Empresa:
Marvell Engineering (CE) develops Marvell's most advanced High-Speed SerDes (HSS) IPs covering multiple applications, Switch, Storage... algorithm development, circuit design, physical design, packaging, etc., is a function team responsible of validating...
Lugar:
San Diego, CA | 16/07/2026 18:07:24 PM | Salario: S/. $129100 - 191030 per year | Empresa:
Marvell qualifications. Primary Responsibilities: A Process Integrator collaborates with Yield Analysis, Device and Defect Engineers, IPS... technical problems and deliver product milestones;interfacing between IPS, F11x process engineering, finance, planning, wafer...
, and implement analog circuits and mixed-signal IPs, including ADCs, DACs, voltage regulators, and high-speed I/O interfaces... state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology...
Lugar:
Hillsboro, OR | 16/06/2026 23:06:25 PM | Salario: S/. No Especificado | Empresa:
Intel and collaborating with the SiPh fab process integration, Integrated Photonics Solutions (IPS) R&D design team, Foundry Q&R teams... while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the...
into their AI accelerators and GPUs. The technology is fully compatible with both protocol and physical layers, including standard 2.5D packaging... Own the end‑to‑end product design spanning Electrical IC, Photonic IC, firmware stack, and advanced packaging design...
development, circuit design, physical design, packaging, etc., is a function team responsible of validating all Marvell HSS IPs...) develops Marvell most advanced High-Speed SerDes (HSS) IPs covering multiple applications, Switch, Automotive, Storage, Optics...
development, circuit design, physical design, packaging, etc., is a function team responsible of validating all Marvell HSS IPs...) develops Marvell most advanced High-Speed SerDes (HSS) IPs covering multiple applications, Switch, Automotive, Storage, Optics...
by delivering cutting-edge silicon process and packaging technology leadership for the AI era. Intel Foundry will be differentiated... x86 cores, graphics, AI, and Arm/RISC-V IPs, world-class design services, and operationally resilient global manufacturing...
Lugar:
Chandler, AZ | 06/05/2026 18:05:50 PM | Salario: S/. No Especificado | Empresa:
Intel