, and implement analog circuits and mixed-signal IPs, including ADCs, DACs, voltage regulators, and high-speed I/O interfaces... state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology...
Lugar:
Hillsboro, OR | 16/06/2026 17:06:42 PM | Salario: S/. No Especificado | Empresa:
Intel customers globally. Foundry Services will be differentiated from other foundries with a combination of leading-edge packaging... and RISC-V ecosystem IPs. Foundry Services will also provide access to silicon design services to help our customers seamlessly...
Lugar:
Chandler, AZ | 14/06/2026 21:06:23 PM | Salario: S/. $105650 - 172860 per year | Empresa:
IntelIPs, RF/mm Wave circuits and 3D IC, and conducts comprehensive Si validation on process and package development test... to guide silicon and packaging technology definition to maximize technology PPA entitlement and minimize process risks and cost...
Lugar:
Hillsboro, OR | 12/06/2026 00:06:30 AM | Salario: S/. No Especificado | Empresa:
Intel and collaborating with the SiPh fab process integration, Integrated Photonics Solutions (IPS) R&D design team, Foundry Q&R teams... while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the...
qualifications. Primary Responsibilities: A Process Integrator collaborates with Yield Analysis, Device and Defect Engineers, IPS... technical problems and deliver product milestones;interfacing between IPS, F11x process engineering, finance, planning, wafer...
into their AI accelerators and GPUs. The technology is fully compatible with both protocol and physical layers, including standard 2.5D packaging... Own the end‑to‑end product design spanning Electrical IC, Photonic IC, firmware stack, and advanced packaging design...
development, circuit design, physical design, packaging, etc., is a function team responsible of validating all Marvell HSS IPs...) develops Marvell most advanced High-Speed SerDes (HSS) IPs covering multiple applications, Switch, Automotive, Storage, Optics...
by delivering cutting-edge silicon process and packaging technology leadership for the AI era. Intel Foundry will be differentiated... x86 cores, graphics, AI, and Arm/RISC-V IPs, world-class design services, and operationally resilient global manufacturing...
Lugar:
Chandler, AZ | 07/05/2026 02:05:35 AM | Salario: S/. No Especificado | Empresa:
Intel development, circuit design, physical design, packaging, etc., is a function team responsible of validating all Marvell HSS IPs...) develops Marvell most advanced High-Speed SerDes (HSS) IPs covering multiple applications, Switch, Automotive, Storage, Optics...
development, circuit design, physical design, packaging, etc., is a function team responsible of validating all Marvell HSS IPs...) develops Marvell most advanced High-Speed SerDes (HSS) IPs covering multiple applications, Switch, Automotive, Storage, Optics...