Job Details: Job Description: Intel's Advanced Packaging Technology Manufacturing (APTM) group is a critical division driving the next generation of semiconductor packaging solutions. The team focuses on groundbreaking technologies that...
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Phoenix, AZ | 01/05/2026 01:05:31 AM | Salario: S/. $99030 - 139810 per year | Empresa:
IntelPosition Summary Our Deloitte Human Capital team helps organizations create value through people performance. We work with clients to reimagine work, the workforce, and the workplace across the enterprise and to transform their HR functio...
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Rosslyn, VA | 01/05/2026 00:05:56 AM | Salario: S/. $108000 - 198000 per year | Empresa:
DeloitteAbout NCR VOYIX NCR Voyix Corporation (NYSE: VYX) is a global platform-powered leader in unified commerce for shopping and dining. Combining a flexible, intelligent platform with end-to-end payments capabilities and services developed thr...
Job Details: Job Description: Join Intel's Advanced Packaging Technology Development organization as a Packaging Module Development Engineer. In this critical role, you will drive the development and optimization of processes and equipm...
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Phoenix, AZ | 30/04/2026 22:04:11 PM | Salario: S/. No Especificado | Empresa:
IntelJob Details: Job Description: The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile, edge, a...
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Phoenix, AZ | 30/04/2026 18:04:05 PM | Salario: S/. No Especificado | Empresa:
IntelJob Category: Engineering, Manufacturing Degree Level: Bachelors Job Description: We are seeking a highly motivated and experienced semiconductor Senior Module Engineer to join our growing 300mm Post Fab team in East Fishkill, NY. Thi...
Description and Functions Open Until Filled GENERAL DESCRIPTION: The Office of State Lands and Investments, Wyoming State Forestry Division, seeks a Wildland Fire Suppression Module Leader in Douglas, Wyoming. Bring your knowledge, sk...
Job Details: Job Description: Assembly and Test Technology Development (ATTD) Microelectronic Packaging Engineers provide project management, package design/development and sustaining support for integrated circuit or semiconductor asse...
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Phoenix, AZ | 28/04/2026 17:04:14 PM | Salario: S/. $99030 - 139810 per year | Empresa:
IntelBuilding Name: UVMMC - Medical Center - Main Campus Location Address: 111 Colchester Avenue, Burlington Vermont Regular Department: Rheumatology & Pulmonary Full Time Standard Hours: 40 Biweekly Scheduled Hours: Shift: Day-8Hr...
Date Posted: 2026-04-22 Country: United States of America Location: US-NY-ROME-104 ~ 104 Otis St ~ OTIS Position Role Type: Onsite U.S. Citizen, U.S. Person, or Immigration Status Requirements: U.S. citizenship is required, as only ...