Packaging Module Development Engineer

Job Details: Job Description: The Role and Impact As a Packaging Module Development Engineer within Intel's Assembly Technology Development (ATD) team, you will be at the forefront of innovation, driving the advancement of cutting-edg...

Lugar: Phoenix, AZ | 16/06/2026 21:06:02 PM | Salario: S/. No Especificado | Empresa: Intel

Packaging Module Engineer

Job Details: Job Description: The Role and Impact As a Packaging Module Engineer, you will play a pivotal role in shaping Intel's advanced packaging solutions that directly impact the delivery, performance, and sustainability of cutti...

Lugar: Phoenix, AZ | 16/06/2026 19:06:40 PM | Salario: S/. $99030 - 188890 per year | Empresa: Intel

Module Development Engineer

Job Details: Job Description: Note: This role requires regular onsite presence to fulfill essential job responsibilities. Drives technology development and enablement for both high volume manufacturing and future technology, provides proc...

Lugar: Hillsboro, OR | 16/06/2026 17:06:29 PM | Salario: S/. $99030 - 188890 per year | Empresa: Intel

Module Development Engineer

Job Details: Job Description: Join Intel as a Module Development Engineer and become a key driver in advancing cutting-edge technologies within high-volume manufacturing and future technology development. In this role, you will lead the...

Lugar: Hillsboro, OR | 14/06/2026 21:06:27 PM | Salario: S/. $99030 - 188890 per year | Empresa: Intel